Features:
1. High thermal conductivity, low thermal resistance and low capacitance .
2. AIN material used, have excellent thermal conductivity and high Reliability
3. Directing heat to thermal ground panel, heat sinker or any other heat disspation position to control component's temperature and improve circuit reliability.
4. The inherent low capacitance makes the devices virtually transparent at RF/MW frequencies.
5. The devices provide additional protection to adjacent components from hot spot thermal loads.
6. The devices offer cost effective thermal management solution.
Features:
1. High thermal conductivity, low thermal resistance and low capacitance .
2. AIN material used, have excellent thermal conductivity and high Reliability
3. Directing heat to thermal ground panel, heat sinker or any other heat disspation position to control component's temperature and improve circuit reliability.
4. The inherent low capacitance makes the devices virtually transparent at RF/MW frequencies.
5. The devices provide additional protection to adjacent components from hot spot thermal loads.
6. The devices offer cost effective thermal management solution.
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