Wire-bond Chip Capacitors
Features:
1.Same assembling wtih semiconductor chip, wire bonding is applicable;
2.Higher cap and smaller chip size than SLCC, excellent temperature stability;
3.Excellent frequency characteristics, low ESL and high self-resonance frequency.
Features:
1.Same assembling wtih semiconductor chip, wire bonding is applicable;
2.Higher cap and smaller chip size than SLCC, excellent temperature stability;
3.Excellent frequency characteristics, low ESL and high self-resonance frequency.
MA Gold Wire Bonding MLCC.pdf
京公网安备11011502038316号